Stereo Phone Jack Connector DC Jack DIP/SMT

Stereo Phone Jack Connector DC Jack DIP/SMT

Applications: Includunt vis humilis in/off designationes, instrumentationes, telecommunicationes, perficiendi audio, computers/servatores, networking et more. 1) Computer producta 2) Consumer producta 3) Machinationes Communicationis) Instrumentation
Specification:1.Contactus Resistentia: ≤ 100mΩ2.Insulation Resistentia: ≥ 100mΩ3.Consistere intentione: AC500V(50-60Hz) 1 min4.Vita mechanica: 5000 circuitus.Temperatura operans Range: -25ºC-85ºC6.Ambiens Umor Used: ≤ 85% RH7.Solder Facultates: 245± 5ºC, 5± 1S8.Consiste Solding Temperaturae: 260± 5ºC, 5±1S

Condiciones weldingae:1.Hando solidandi ferrum solidandi 30 wa watts, moderatum ad 350ºC circiter 3 secundis dum solidaribus applicandis 2. Undo solidatorium/Reflow Soldering Apicem temperatura clibani undae ad 260ºC max ponenda est.Conditio solidandi Temperature Profile

Materia:1.Basi: PBT2.Cover: PBT3.Insulation: POM4.Terminatio: Phosphor aereum Ag- patella.Testa: Immaculata ferri Natural6.Ring: Brass Ni patella

Features:1.Cum AC97 et DHA etc. alia configuratione design; II.Terminatio fit ex aeneis eximiis materia ad vitam longam cert 3 .Conventus modi: DIP and SMT4.Flexibilitas designationis interfaciei terminalis est ut nice contactum curet et vitam operantem protrahat.Potest designare connect products aliud

Proprietas generalis, postquam temperatura 40 ±2℃ exposita, insulatio resistentia non erit <30MΩAt humiditas relativa 90% ad 95% pro 48 horis, resistentia insulatio non erit <30MΩDried ad locus temperatus per 30 minuta, resistentia insulatio non erit erit <30MΩConnector 5000 cyclorum insertionum et recessus sustinebit cum probatione obturaculum contactus resistentiae non excedat 0.1ΩA amplis A/V connexiones praesto sunt

Plus enim detais grata est contact us!